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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
LUYS22841/P1/TBS-X
DATA SHEET
DOC. NO : REV. DATE :
QW0905-LUYS22841/P1/TBS-X B
: 14 - Jan - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUYS22841/P1/TBS-X Page 1/5
Package Dimensions
P2
G H
H2 H1 L W0
W2
W1
W3
D
P1
F P
T
LUYS22841/P1
4.0 3.8 6.3
9.8O 0.5
1.5MAX
25.0MIN
1/4
0.5 TYP
2.54TYP
1.0MIN
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUYS22841/P1/TBS-X Page 2/5
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol UYS Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 50 90 120 10 2000 -40 ~ +85 -40 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT
g A V J J
Typical Electrical & Optical Characteristics (Ta=25 J )
PART NO
MATERIAL Emitted
COLOR
Forward Dominant Spectral voltage wave halfwidth @20mA(V) length f nm f Dnm
Luminous intensity
@20mA(mcd)
Viewing angle 2c 1/2 (deg)
Lens
Min. Max. Min. Typ.
Horizontal Axis 124
LUYS22841/P1/TBS-X
AlGaInP
Yellow
Yellow Transparent
587
15
1.7
2.6
300
550
Vertical Axis 86
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUYS22841/P1/TBS-X E Dimension Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
------------------
Page 3/5
Minimum mm inch
0.15 0.09
-------
Maximum mm
4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 22.0 21.5 19.0 36 11
inch
0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 0.87 0.85 0.75 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F H
3.8 2.3
-------
TBS-1 TBS-2 Feed Hole To Bottom Of Component TBS-3 TBS-5 TBS-6 TBS-7 TBS-8 TBS-9 TBS-10 TBS-11 TBS-12 TBS-13 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
-------------------------------------------------------------
17.5 21.5 25.5 22.5 19.9 H1 24.0 24.5 19.0 18.4 21.0 20.5 18.0 H2 L P P1 P2 T W0 W1 W2 W3 12.4 4.4 5.1
-------------
0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72 0.83 0.81 0.71
-------
W0 0.49 0.17 0.2
-------
13 5.8 7.7 1.42 9.75 15.5 4.0 19
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TBS=Tape And Box Straight Leads
E Dimensions Symbol Information
Specification
E Package Dimensions
maxmum mm 340 275 60 inch 13.4 10.8 2.4
Description
Overall Length Overall Width Overall Thickness
Symbol
minimum mm inch 13.0 10.4 1.97
L W H
330 265 50
Quantity/Box
2500PCS
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUYS22841/P1/TBS-X Page 4/5
Typical Electro-Optical Characteristics Curve
UYS CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100
Relative Intensity Normalize @20mA
2.5 2.0 1.5 1.0 0.5 0.0
10
1.0 0.1 1.0 1.5 2.0 2.5 3.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA Normalize @25J
Forward Voltage@20mA Normalize @25J
1.1
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.0
0.9
0.8 -40 -20 0 20 40 60 80 100
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
1.0
Fig.6 Directivity Radiation
Relative Intensity@20mA
Vertical Axis 124 X
0X -30X
0.5
Horizontal Axis 86 X
30X
-60X
60X
0.0 500 550 600 650
100% 75% 50%
25%
0
25%
50% 75% 100%
Wavelength (nm)
Radiation Angle(0.5):H 86 Degree/V 124 Degree
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUYS22841/P1/TBS-X Page 5/5
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 J O 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 J O 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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